• Substrate: Preferably 50-100μm PE or PET with thickness deviation ≤5% to avoid peeling force fluctuations from uneven stretching.

• Adhesive Layer: Matched to board surface characteristics:

• Smooth surface: Medium/low viscosity (5-10N/25mm)
• Frosted surface: High viscosity (15-20N/25mm)
• Thickness controlled at 10-20μm (thicker causes residue, thinner reduces viscosity)

• Adhesive raw materials require compatibility testing to prevent reactions with stainless steel.

• Coating: Precision comma scraper equipment maintains adhesive layer thickness error within ±2μm

• Curing:

• Temperature strictly maintained at 60-80℃
• Curing time 24-48 hours
• Temperature deviations cause cross-linking issues (high) or insufficient curing (low)

• Winding: Tension controlled at 3-5N to prevent substrate deformation

• Conditions:

• Temperature: 15-30℃
• Humidity: 50%-70%
• Low temperatures require 2-hour room temperature preheating

• Preparation: Clean board surface with isopropyl alcohol to remove oil/dust

• Application: Roller pressure at 0.1-0.3MPa, applied middle-to-edge to prevent bubbles

• Sampling: 20 samples per batch for 180° peel test (300mm/min speed)

• Requirements:

• Peeling force deviation ≤10%
• 72-hour aging test at 40℃/90% humidity
• Peeling force attenuation rate ≤15%
• Adhesive layer transfer observation